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CVDGraphene film on silicon substrate1cmx1cm

Price range: $291.67 through $354.17

1-8 layer graphene on Si wafer. High mobility, uniform coverage, semiconductor compatible. Ready for FETs, sensors, MEMS, and device R&D. Custom patterning available.

  • Substrate: Silicon

  • Quality: Raman verified

  • Applications: Electronics, sensors, research

Email: sales@maxnanotech.com

Important Notes

  •  No Refunds or Exchanges: All sales are final. MAXNANO does not provide return, exchange, or refund services under any circumstances.
  • Customs and Import Obligations: Clearance procedures, import duties, taxes, and related costs are solely the responsibility of the recipient/importer. MAXNANO shall not be held liable for delays, rejections, or any additional expenses incurred during customs processes. Such issues shall not constitute grounds for order cancellation or refund.
  • Order Cancellation: Orders cannot be revoked once submitted. No refunds will be issued for cancelled or undelivered orders.
  • Indemnification: The purchaser agrees to bear all claims, losses, legal liabilities, and expenses arising from the use of products and services, and shall hold MAXNANO, its affiliates, and personnel harmless from such obligations.
  • Terms and Conditions: All orders and business interactions are subject to MAXNANO’s standard Terms and Agreements.

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Product Overview
We produce high-quality CVD graphene films on silicon substrates, providing an ideal platform for semiconductor research and electronic device development. Our manufacturing process utilizes copper-catalyzed surface growth to create uniform graphene layers, which we then transfer onto standard silicon substrates using optimized techniques. This combination offers exceptional compatibility with existing semiconductor processes and characterization methods.

Specifications

  • Substrate: Standard silicon wafer

  • Graphene Area: 1cm × 1cm

  • Layer Options: Single, Double, 3-5, 6-8 layers

  • Quality Assurance: Raman characterization referenced to silicon oxide substrates

Key Features

  • Semiconductor Compatibility: Ideal for integration with silicon-based devices

  • Excellent Electrical Properties: High carrier mobility with low sheet resistance

  • Surface Uniformity: Consistent coverage across entire area

  • Mechanical Durability: Withstands standard processing conditions

  • Thermal Stability: Maintains performance under processing temperatures

Applications

  • Semiconductor device research and development

  • Field-effect transistors and nanoelectronics

  • Sensor and detector fabrication

  • MEMS and NEMS applications

  • Fundamental materials research

Technical Advantages

  • Ready for immediate device fabrication

  • Compatible with standard cleanroom processes

  • Ideal for electrical characterization studies

  • Suitable for both research and prototyping

  • Custom patterning available

Quality Certification

  • Batch-to-b consistency verification

  • Electrical performance testing available

  • Surface quality inspection reports

  • Custom characterization services offered

Contact Information
For technical specifications and research pricing:
Email: sales@maxnanotech.com

Weight 100 g
Dimensions 30 × 20 × 20 mm
Specification

Layers: Single-layer; Area: 1 cm × 1 cm, Layers: Double-layer; Area: 1 cm × 1 cm, Layers: 3–5 layers; Area: 1 cm × 1 cm, Layers: 6–8 layers; Area: 1 cm × 1 cm

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